US Patent Issued to HONGQISHENG PRECISION ELECTRONICS (QINHUANGDAO), AVARY HOLDING (SHENZHEN), GARUDA TECHNOLOGY on Oct. 20 for "Circuit board having a switch and method for fabricating the same" (Chinese Inventor)

Posted On: 2026-10-21

ALEXANDRIA, Va., Oct. 21 -- United States Patent no. 12,772,374, issued on Oct. 20, was assigned to HONGQISHENG PRECISION ELECTRONICS (QINHUANGDAO) Co. LTD. (Hebei Province, China), AVARY HOLDING (SHE... Read More

US Patent Issued to SAMSUNG ELECTRO-MECHANICS on Oct. 20 for "Printed circuit board" (South Korean Inventors)

Posted On: 2026-10-21

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ALEXANDRIA, Va., Oct. 21 -- United States Patent no. 12,772,375, issued on Oct. 20, was assigned to SAMSUNG ELECTRO-MECHANICS Co. LTD. (Suwon-si, South Korea). "Printed circuit board" was invented by... Read More

US Patent Issued to LOTTE ENERGY MATERIALS CORPORATON on Oct. 20 for "Surface-treated copper foil with heat resistance, and copper clad laminate and printed wiring board including the same" (South Korean Inventors)

Posted On: 2026-10-21

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ALEXANDRIA, Va., Oct. 21 -- United States Patent no. 12,772,376, issued on Oct. 20, was assigned to LOTTE ENERGY MATERIALS CORPORATON (Jeollabuk-do, South Korea). "Surface-treated copper foil with he... Read More

US Patent Issued to SAMSUNG ELECTRO-MECHANICS on Oct. 20 for "Printed circuit board and method of manufacturing the same" (South Korean Inventors)

Posted On: 2026-10-21

Government News US Fed News Patentwipo

ALEXANDRIA, Va., Oct. 21 -- United States Patent no. 12,772,377, issued on Oct. 20, was assigned to SAMSUNG ELECTRO-MECHANICS Co. LTD. (Suwon-si, South Korea). "Printed circuit board and method of ma... Read More

US Patent Issued to IBIDEN on Oct. 20 for "Wiring substrate having multiple build-up parts" (Japanese Inventors)

Posted On: 2026-10-21

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ALEXANDRIA, Va., Oct. 21 -- United States Patent no. 12,772,378, issued on Oct. 20, was assigned to IBIDEN Co. Ltd. (Ogaki, Japan). "Wiring substrate having multiple build-up parts" was invented by M... Read More

US Patent Issued to TOPPAN HOLDINGS on Oct. 20 for "Glass substrate, through-electrode, multilayer wiring substrate, and glass substrate manufacturing method" (Japanese Inventor)

Posted On: 2026-10-21

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ALEXANDRIA, Va., Oct. 21 -- United States Patent no. 12,772,379, issued on Oct. 20, was assigned to TOPPAN HOLDINGS INC. (Tokyo). "Glass substrate, through-electrode, multilayer wiring substrate, and... Read More

US Patent Issued to HELLA on Oct. 20 for "Circuit system and method for radar, lidar, or camera systems" (German Inventor)

Posted On: 2026-10-21

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ALEXANDRIA, Va., Oct. 21 -- United States Patent no. 12,772,380, issued on Oct. 20, was assigned to HELLA GmbH & Co. KGaA (Lippstadt, Germany). "Circuit system and method for radar, lidar, or camera ... Read More

US Patent Issued to Snap on Oct. 20 for "Corner shield protection for surface mount devices" (Illinois, California Inventors)

Posted On: 2026-10-21

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ALEXANDRIA, Va., Oct. 21 -- United States Patent no. 12,772,381, issued on Oct. 20, was assigned to Snap Inc. (Santa Monica, Calif.). "Corner shield protection for surface mount devices" was invented... Read More

US Patent Issued to ALPS ALPINE on Oct. 20 for "Restricting device for flexible wiring board and display device using the restricting device" (Japanese Inventors)

Posted On: 2026-10-21

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ALEXANDRIA, Va., Oct. 21 -- United States Patent no. 12,772,382, issued on Oct. 20, was assigned to ALPS ALPINE Co. LTD. (Tokyo). "Restricting device for flexible wiring board and display device usin... Read More

US Patent Issued to Hewlett Packard Enterprise Development on Oct. 20 for "Apparatus, system, and method for backdrilling vias based on depth measurements taken during primary drilling applications" (Massachusetts Inventor)

Posted On: 2026-10-21

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ALEXANDRIA, Va., Oct. 21 -- United States Patent no. 12,772,383, issued on Oct. 20, was assigned to Hewlett Packard Enterprise Development LP (Spring, Texas). "Apparatus, system, and method for backd... Read More

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US Patent Issued to HONGQISHENG PRECISION ELECTRONICS (QINHUANGDAO), AVARY HOLDING (SHENZHEN), GARUDA TECHNOLOGY on Oct. 20 for "Circuit board having a switch and method for fabricating the same" (Chinese Inventor)

US Patent Issued to SAMSUNG ELECTRO-MECHANICS on Oct. 20 for "Printed circuit board" (South Korean Inventors)

US Patent Issued to LOTTE ENERGY MATERIALS CORPORATON on Oct. 20 for "Surface-treated copper foil with heat resistance, and copper clad laminate and printed wiring board including the same" (South Korean Inventors)

US Patent Issued to SAMSUNG ELECTRO-MECHANICS on Oct. 20 for "Printed circuit board and method of manufacturing the same" (South Korean Inventors)

US Patent Issued to IBIDEN on Oct. 20 for "Wiring substrate having multiple build-up parts" (Japanese Inventors)

US Patent Issued to TOPPAN HOLDINGS on Oct. 20 for "Glass substrate, through-electrode, multilayer wiring substrate, and glass substrate manufacturing method" (Japanese Inventor)

US Patent Issued to HELLA on Oct. 20 for "Circuit system and method for radar, lidar, or camera systems" (German Inventor)

US Patent Issued to Snap on Oct. 20 for "Corner shield protection for surface mount devices" (Illinois, California Inventors)

US Patent Issued to ALPS ALPINE on Oct. 20 for "Restricting device for flexible wiring board and display device using the restricting device" (Japanese Inventors)

US Patent Issued to Hewlett Packard Enterprise Development on Oct. 20 for "Apparatus, system, and method for backdrilling vias based on depth measurements taken during primary drilling applications" (Massachusetts Inventor)